Wednesday, November 01, 2006

Samsung Electronics develops 16-chip package

Amazing this is just what I need, a 16GB Flash chip for my Cell Phone or MP3 player.
Samsung Electronics developed the industry's first process to enable production of a 16-chip multi-chip package (MCP) of memory which is a small form factor high density chip, that can enable up to 16GB MCP solution. This 16GB will be the max for the new chip.

" For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24/25 of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns. This is just 65% the thickness of the 10-Chip MCP wafer (45-microns) Samsung developed in 2005 and similar to the size of a human cell, which measures 20 to 30 microns" Stated Samsung

They claim they will be able to mass produce this chip at a fast pace. So we could this some time soon, even though they did not release details on when the plan on releasing the chip or on the price.

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